EP4SGX70DF29C4G vs EP4SGX70DF29I3G Vergleich
Detaillierter Direktvergleich von EP4SGX70DF29C4G von Intel und EP4SGX70DF29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX70DF29C4G | EP4SGX70DF29I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $196,99 | $1.080,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 72,600 | 72,600 |
| Total Memory Bits | 7,564,880 | — |
| User I/O Count | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Package Type | 780-BBGA, FCBGA | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | BGA | DF29 |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C4 (commercial) | -3 |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Process Technology | — | 40 nm |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Halogenfrei | — | [DATA_NEEDED: halogen-free claim] |