EP4SGX70DF29C4G vs EP4SGX70DF29I3G Comparación
Comparación detallada lado a lado de EP4SGX70DF29C4G por Intel y EP4SGX70DF29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX70DF29C4G | EP4SGX70DF29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $196,99 | $1.080,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 72,600 | 72,600 |
| Total Memory Bits | 7,564,880 | — |
| User I/O Count | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Package Type | 780-BBGA, FCBGA | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | BGA | DF29 |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C4 (commercial) | -3 |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Process Technology | — | 40 nm |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Sin halógenos | — | [DATA_NEEDED: halogen-free claim] |