EPF10K100EBC356-1X vs EPF10K100ABI356-3 Vergleich
Detaillierter Direktvergleich von EPF10K100EBC356-1X von Intel und EPF10K100ABI356-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera
EPF10K100ABI356-3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EPF10K100EBC356-1X | EPF10K100ABI356-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $65,80 |
| Series | FLEX 10KE | — |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | 624 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Betriebstemperatur | 0 C to +70 C (Commercial) | 0 C to 70 C |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -3 (slowest of three grades) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not stated in source data] |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | FLEX 10KA |
| Logic Elements (LEs) | — | 4992 |
| Embedded Memory (RAM bits) | — | 24576 |
| Maximum User I/Os | — | 274 |
| Gehäuse | — | 356-LBGA |
| Process Technology | — | 0.3 um |
| Versorgungsspannung | — | 3.3 V |
| Maximum Frequency | — | 125 MHz |