EPF10K100EBC356-1X vs EPF10K100ABI356-3 比較
詳細な並列比較: EPF10K100EBC356-1X メーカー: Intel および EPF10K100ABI356-3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EPF10K100EBC356-1X | EPF10K100ABI356-3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | NRND | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $165.00 | $65.80 |
| Series | FLEX 10KE | — |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | 624 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| 動作温度 | 0 C to +70 C (Commercial) | 0 C to 70 C |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -3 (slowest of three grades) |
| 実装タイプ | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| RoHS ステータス | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not stated in source data] |
| MSLレベル | [DATA_NEEDED: MSL rating] | — |
| Family | — | FLEX 10KA |
| Logic Elements (LEs) | — | 4992 |
| Embedded Memory (RAM bits) | — | 24576 |
| Maximum User I/Os | — | 274 |
| パッケージ | — | 356-LBGA |
| Process Technology | — | 0.3 um |
| 電源電圧 | — | 3.3 V |
| Maximum Frequency | — | 125 MHz |