EPF10K100EBC356-3 vs EPF10K130EBC356-3 Vergleich
Detaillierter Direktvergleich von EPF10K100EBC356-3 von Intel und EPF10K130EBC356-3 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K100EBC356-3 | EPF10K130EBC356-3 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $62,50 | $35,20 |
| Family | FLEX-10KE | FLEX-10KE |
| Logic Elements / Cells | 4,992 | — |
| Total Gates | ~100,000 | — |
| Logic Array Blocks (LABs) | 624 | 832 |
| Embedded Memory (RAM bits) | 49,152 | — |
| User I/Os | 274 | — |
| Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) | — |
| Speed Grade | -3 | -3 (fastest) |
| Propagation Delay (typical) | 0.6 ns | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 micron CMOS | 0.22 µm SRAM-based CMOS |
| Configuration Technology | SRAM (volatile) | — |
| Betriebstemperatur | 0 C to 70 C (Commercial) | 0 °C to +70 °C (Commercial) |
| Gehäuse | 356-LBGA (35 x 35 mm) | 356-LBGA (35x35 mm) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-compliant (SnPb ball finish on legacy BGA) |
| Series | — | FLEX-10KE |
| Typical Gates | — | 130,000 |
| Logic Elements | — | 8,192 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 bits (12 EABs × 2 Kbit) |
| Maximum User I/Os | — | 274 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V / 5.0 V (multiVolt I/O) |
| Pin-to-Pin Propagation Delay (-3 grade) | — | 0.6 ns |
| Logic Family | — | CMOS |
| Configuration Method | — | SRAM-based, JTAG (IEEE 1149.1) in-system programmable |
| Lead-Free | — | No |
| Lifecycle | — | Obsolete — last-time-buy / Rochester Electronics stock only |