EPF10K100EFC484-3N vs EPF10K100EFC484-1 Vergleich

Detaillierter Direktvergleich von EPF10K100EFC484-3N von Intel und EPF10K100EFC484-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100EFC484-3N EPF10K100EFC484-1
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $142,00 $142,00
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 4992 4,992
Total Gates 100,000 257,000 typical system gates
Embedded Memory (EAB) 49,152 bits (12 EABs) —
Logic Array Blocks (LABs) 624 —
User I/Os 338 338
Process Technology 0.22 µm CMOS 0.42 µm CMOS
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) —
Internal Performance 200 MHz —
Speed Grade -3 (fastest commercial bin) —
Gehäuse 484-ball FineLine BGA (FC484 / FBGA-484) 484-FBGA (FineLine BGA, 23×23 mm)
Temperature Grade Commercial (0 °C to +70 °C) —
Configuration Method SRAM (external EPROM/Flash/JTAG required at power-up) —
Lead-Free / RoHS Yes (N suffix = lead-free) —
Montageart Surface Mount (BGA) Surface Mount (SMT)
Number of LABs/CLBs — 624
Total RAM Bits — 49,152
Embedded Memory (Kbits) — 48 (12 EABs)
Number of Block RAM (EABs) — 12
Operating Supply Voltage (Core) — 2.5 V
Operating Supply Voltage Range — 2.375 V to 2.625 V
Propagation Delay — 0.6 ns
Betriebstemperatur — 0 °C to 70 °C (commercial)
Program Memory Type — SRAM (volatile)
Configuration Interface — JTAG (IEEE 1149.1), serial/parallel EPROM
PCI Support — 3.3 V PCI compliant
RoHS-Status — Non-compliant (per Arrow listing)
Lebenszyklusstatus — Obsolete (EOL)

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