EPF10K130EFC484-3N vs EPF10K200SFC484-2N Vergleich

Detaillierter Direktvergleich von EPF10K130EFC484-3N von Intel und EPF10K200SFC484-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K130EFC484-3N EPF10K200SFC484-2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $109,25 $95,00
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 —
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) —
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
Montageart Surface Mount Surface Mount
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS-Status [DATA_NEEDED: RoHS status] —
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements / Cells — 9,984
Gate Count — 200,000
Logic Array Blocks (LABs) — 1,248
Embedded RAM Bits — 98,304 (96 Kbit)
User I/O Pins — 369
Number of I/Os (alt spec) — 470 (per digchip datasheet summary)
Core Supply Voltage — 2.375 V to 2.625 V (2.5 V nominal)
Internal Performance — 200 MHz
Propagation Delay — 0.4 ns
Betriebstemperatur — 0°C to 70°C (Commercial)
Gehäuse — 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch
Programming Interface — JTAG (IEEE 1149.1), SRAM configuration
I/O Standard Support — 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V)
Logic Family — CMOS
Compliance / Lead Status — [DATA_NEEDED: RoHS status]

Datenblätter & Ressourcen

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