EPF10K130EFC672-2X vs EPF10K130EFC672-1X Vergleich
Detaillierter Direktvergleich von EPF10K130EFC672-2X von Intel und EPF10K130EFC672-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K130EFC672-2X | EPF10K130EFC672-1X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $342,75 |
| Series | FLEX 10KE | FLEX 10KE® |
| Number of Logic Elements (LEs) | 6656 | — |
| Number of Logic Array Blocks (LABs) | 832 | — |
| Total RAM Bits | 65536 | 65,536 |
| Number of User I/Os | 413 | — |
| Number of DLLs | 4 | — |
| Gehäuse | 672-FBGA (FineLine BGA, 27x27 mm) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) | — |
| Betriebstemperatur | 0C to +70C (commercial) | — |
| Process Technology | 0.22 μm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| Configuration Method | Serial configuration device, JTAG | — |
| Logic Family | CMOS, SRAM-based | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Family | — | FLEX 10KE |
| Typical Gates | — | 130,000 |
| Logic Elements (LEs) | — | 6,656 |
| Logic Array Blocks (LABs) | — | 832 |
| User I/Os | — | 413 |
| Number of I/O Banks | — | 8 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Internal Operating Frequency | — | up to 333.33 MHz |
| Speed Grade | — | -1X |
| Operating Temperature (Commercial) | — | 0 °C to +70 °C |
| Configuration Mode | — | Passive Serial, JTAG, ByteBlaster |
| Moisture Sensitivity Level | — | MSL 3 (per JEDEC J-STD-020) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |