EPF10K200SBC356-2X vs EPF10K200SBC356-3 Vergleich

Detaillierter Direktvergleich von EPF10K200SBC356-2X von Intel und EPF10K200SBC356-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SBC356-2X EPF10K200SBC356-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $295,00 $87,50
Series FLEX-10KS —
Family FLEX 10K FLEX 10K
Logic Elements / Cells 9984 —
Approximate Gate Count 200,000 —
Logic Array Blocks (LABs) 1248 1,248
User I/O Count 274 —
Gehäuse 356-LBGA (35x35 mm, 1.27 mm pitch) PBGA-356 (35 x 35 mm, 1.27 mm pitch)
Versorgungsspannung 2.375 V to 2.625 V (core) —
Process Technology CMOS 0.22 µm 0.22 um CMOS, 4 metal layers
Propagation Delay (typ.) 0.4 ns —
Speed Grade -2 —
Betriebstemperatur 0 °C to +70 °C (commercial) 0 C to 70 C (Commercial)
Montageart Surface Mount Surface Mount
Lead Free Status / RoHS RoHS non-compliant (per third-party listing) —
Configuration Method SRAM-based, requires external configuration device (EPC2/EPC8) —
In-System Programmability Yes (via JTAG or serial interface) —
Device Type — FPGA - Field Programmable Gate Array
Typical Gates — 200,000
Logic Elements (Cells) — 9,984
Embedded Array Blocks (EABs) — 12
Total EAB RAM — 98,304 bits
User I/Os — 470 (package exposes 274 bonded-out)
Flip-Flops — 4,992
Core Supply Voltage — 2.375 V to 2.625 V
Propagation Delay — 0.4 ns
Internal Performance (fmax) — 250 MHz
Configuration Mode — Passive Serial / Passive Parallel / JTAG
MultiVolt I/O — 2.5 V / 3.3 V / 5.0 V
Logic Family — CMOS
RoHS-Status — [DATA_NEEDED: rohs status]

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