EPF10K200SFC484-2N vs EPF10K200SFC484-2X Vergleich

Detaillierter Direktvergleich von EPF10K200SFC484-2N von Intel und EPF10K200SFC484-2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SFC484-2N EPF10K200SFC484-2X
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $95,00 $171,00
Family FLEX 10KE FLEX 10K
Logic Elements / Cells 9,984 —
Gate Count 200,000 —
Logic Array Blocks (LABs) 1,248 —
Embedded RAM Bits 98,304 (96 Kbit) —
User I/O Pins 369 —
Number of I/Os (alt spec) 470 (per digchip datasheet summary) —
Core Supply Voltage 2.375 V to 2.625 V (2.5 V nominal) —
Internal Performance 200 MHz —
Propagation Delay 0.4 ns —
Process Technology 0.22 µm CMOS [DATA_NEEDED: process node nm]
Betriebstemperatur 0°C to 70°C (Commercial) 0C to +70C (commercial)
Gehäuse 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1), SRAM configuration —
I/O Standard Support 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V) —
Logic Family CMOS —
Compliance / Lead Status [DATA_NEEDED: RoHS status] —
Series — FLEX 10KS
Number of Logic Elements / Cells — 9984
Number of LABs / CLBs — 1248
Total RAM Bits — 98304
Number of Gates — 200000 (typical)
Number of I/O — 369
Core Voltage - Supply — 2.375 V to 2.625 V
Operating Frequency (max) — 250 MHz (family-typical, -2 speed grade)
Gehäuse / Bauform — 484-BBGA (FineLine BGA)
Supplier Device Package — 484-FBGA (23 x 23 mm, 1.0 mm pitch)
Technology — CMOS, SRAM-based configuration
Configuration Memory — External serial (EPC1/EPC2 family compatible)
JTAG Support — IEEE 1149.1-1990 boundary-scan
RoHS-Status — [DATA_NEEDED: rohs status]

Datenblätter & Ressourcen

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