EPF10K200SFC484-2X - FLEX 10K FPGA, 200K Gates, 484-BGA | Intel
Teilenummer: EPF10K200SFC484-2X ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EPF10K200SFC484-2X Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated memory blocks that can be re-programmed to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and the FLEX 10K family pioneered embedded array block (EAB) integration of SRAM memory with logic fabric - the conceptual ancestor of modern System-on-Chip FPGAs. The EPF10K200SFC484-2X therefore occupies the role of a glue-logic and co-processing accelerator in legacy industrial, telecom, and test-and-measurement systems.
Key features include 1,248 Logic Array Blocks (LABs), 9,984 logic elements, four-phase on-chip PLL (where equipped in the family), built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std 1149.1-1990, and in-system programmability via SRAM configuration cells. The -2X speed grade offers approximately 250 MHz internal operation. The 5.0-V tolerant I/O bank supports PCI and other legacy bus signaling through level translation.
The device utilizes a CMOS SRAM-based configuration cell, allowing unlimited re-programmability and rapid prototyping. Embedded Array Blocks (EABs) provide dedicated dual-port SRAM that can be configured as 256 x 8, 512 x 4, 1024 x 2, or 2048 x 1 memory blocks. Continuous FastTrack interconnect provides predictable routing delays across the device.
Typical applications include industrial control systems, telecommunications infrastructure, ASIC prototyping, custom DSP pipelines, and legacy PCI / ISA bus interface designs where the device serves as a programmable bus controller or protocol bridge. The 369 user I/Os and large memory complement suit it to multi-channel data acquisition front-ends.
Designers should plan for external configuration memory (EPC2 or compatible serial configuration device), multi-bank I/O voltage reference decoupling, and thermal management through the BGA thermal pad. The device is now mature (NRND/EOL) and supply is increasingly restricted to franchised distributors and authorized aftermarket channels such as Rochester Electronics.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für EPF10K200SFC484-2X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K200SFC484-2X (gleiche Bauform und Footprint) – abweichend in Family, Package, Operating Temperature, Speed Grade, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K200SFC484-2N
✅ Drop-In✓ Auf Lager
$95 / Stück
Datenblatt ansehen →EPF10K200SFC484-3N
✅ Drop-In✓ Auf Lager
$261 / Stück
Datenblatt ansehen →EPF10K200SFC484-1N
✅ Drop-In✓ Auf Lager
$185.25 / Stück
Datenblatt ansehen →EPF10K200SFC484-1
✅ Drop-In✓ Auf Lager
$162 / Stück
Datenblatt ansehen →EPF10K200SFC484-2
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →EPF10K200SFC484-1X
✅ Drop-In✓ Auf Lager
$142 / Stück
Datenblatt ansehen →EPF10K200SFC484-2X Grenzwerte & elektrische Eigenschaften
| Series | FLEX 10KS |
| Family | FLEX 10K |
| Number of Logic Elements / Cells | 9984 |
| Number of LABs / CLBs | 1248 |
| Total RAM Bits | 98304 |
| Number of Gates | 200000 (typical) |
| Number of I/O | 369 |
| Core Voltage - Supply | 2.375 V to 2.625 V |
| Operating Frequency (max) | 250 MHz (family-typical, -2 speed grade) |
| Betriebstemperatur | 0C to +70C (commercial) |
| Gehäuse / Bauform | 484-BBGA (FineLine BGA) |
| Supplier Device Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) |
| Montageart | Surface Mount |
| Technology | CMOS, SRAM-based configuration |
| Configuration Memory | External serial (EPC1/EPC2 family compatible) |
| JTAG Support | IEEE 1149.1-1990 boundary-scan |
EPF10K200SFC484-2X 484-fbga (23 x 23 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EPF10K200SFC484-2X (484-fbga (23 x 23 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K200SFC484-2X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K200SFC484-2X ist geeignet für 6 Anwendungs: Industrial Process Control, Telecommunications Infrastructure, ASIC Prototyping and Emulation, Custom DSP Pipeline Implementation, Legacy PCI / ISA Bus Bridge, Test and Measurement Instrumentation.
Industrial Process Control
The EPF10K200SFC484-2X fits legacy industrial process control PLCs and DCS I/O concentrators because of its 369 user I/Os and large logic capacity (9984 cells), enabling parallel glue-logic, custom protocol bridges, and PID control loops without external companion ICs. The 1.0 mm pitch 484-BGA provides a small footprint for a 23 x 23 mm board, and the SRAM-based configuration supports in-field firmware updates via JTAG. Its 2.5 V core and 5 V-tolerant I/O banks simplify integration with 5 V sensor front-ends, op-amp signal conditioning, and 24 V optocoupler-isolated inputs typical in PLC backplanes. Design tip: place a 100 uF bulk cap plus 0.1 uF ceramic per VCCIO bank to suppress the inrush from many simultaneous switching outputs.
Empfohlen
Telecommunications Infrastructure
Telecom line-card and backplane designs of the FLEX 10K era leveraged the EPF10K200SFC484-2X as a TDM bus controller and custom HDLC/SDH framer glue logic. Its 98,304 bits of on-chip dual-port RAM (organized via EABs as 256x8 or 512x4) are sufficient for 4-8 Kbyte first-in/first-out buffers without external SRAM, and the high I/O count interfaces directly to HINTC, T1/E1 transceivers, and LVDS backplanes. The -2X speed grade delivers up to 250 MHz internal operation, sufficient for 155 Mbit/s STS-3 framing. For new designs, the device remains useful as a maintenance replacement card in legacy Sonet/SDH nodes where platform re-validation cost dominates over a modern FPGA migration.
Empfohlen
ASIC Prototyping and Emulation
ASIC prototyping engineers adopted the EPF10K200SFC484-2X as a multi-chip emulation platform because the 9984 logic cells, 1248 LABs, and 369 I/O pins map cleanly to mid-complexity gate-array ASICs of the era (approximately 200K gates). The SRAM configuration enables rapid design iteration through the Quartus II tool chain, and the IEEE 1149.1 JTAG interface allows prototype bring-up with boundary-scan for board-level connectivity verification. The 5 V I/O tolerance is valuable when interfacing to ASIC validation boards using legacy 5 V TTL peripherals. The BGA package enables high-density prototype boards that mirror the target ASIC pinout, shortening validation cycles before tape-out.
Empfohlen
Custom DSP Pipeline Implementation
Custom digital signal processing pipelines - such as FIR filters, FFT stages, and image-processing pre-processors - map efficiently onto the EPF10K200SFC484-2X because the EAB memory blocks implement parallel multiply-accumulate (MAC) arrays directly, eliminating external multiplier chips. The 98,304 RAM bits provide coefficient storage and line-buffer memory for 8-bit grayscale image processing at modest resolutions. Designers achieve 30-50 MHz sample rates for medium-complexity FIR filters in this device. For new DSP work, the device's strength is its mature Quartus II toolchain, which still produces bitstreams from legacy Verilog/VHDL DSP cores without requiring re-engineering.
Empfohlen
Legacy PCI / ISA Bus Bridge
The EPF10K200SFC484-2X serves as a custom PCI / ISA bus bridge in legacy industrial PCs, test-and-measurement chassis, and embedded single-board computers. Its 369 I/Os and 5 V-tolerant banks connect directly to PCI 33 MHz, ISA, and VME bus backplanes, while the 9984 logic cells implement state machines, scatter-gather DMA controllers, and custom interrupt handlers that were not available off-the-shelf in the FLEX 10K era. The -2X speed grade meets 33 MHz PCI timing requirements with margin. The device is favored here because the BGA footprint matches the original FLEX 10K reference designs, avoiding full board re-spins during field-maintenance repair.
Empfohlen
Test and Measurement Instrumentation
Test and measurement front-ends - logic analyzers, protocol exercisers, and ATE pattern generators - relied on the EPF10K200SFC484-2X for stimulus generation and response capture because of its high I/O count, internal RAM, and parallel logic capacity. The 369 user I/Os drive up to 92 channels of 50 MHz stimulus with per-channel timing alignment through the LAB registers. The 5 V I/O tolerance matches legacy TTL test fixtures and older oscilloscope probe pods. Maintenance of installed ATE platforms still requires this part as a direct replacement, justifying the Rochester Electronics authorized aftermarket channel.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K200SFC484-2X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K200SFC484-2N | EPF10K200SFC484-3N | EPF10K200SFC484-1N | EPF10K200SFC484-1 | EPF10K200SFC484-2 | EPF10K200SFC484-1X |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23 x 23 mm) | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same |
| Speed Grade | -2X | -2 | -3 (faster) | -1 (slower) | -1 (slower) | -2 | -1 (slower) |
| Ball Finish | Lead-free (X suffix) | SnPb (leaded) | SnPb (leaded) | SnPb (leaded) | SnPb (leaded) | SnPb (leaded) | Lead-free |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 |
| Number of LABs | 1248 | 1248 | 1248 | 1248 | 1248 | 1248 | 1248 |
| Total RAM Bits | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 |
| User I/Os | 369 | 369 | 369 | 369 | 369 | 369 | 369 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Lead-free assembly compatibility (vs. EPF10K200SFC484-2 (non-X suffix))
- -2 speed grade for balanced timing margin (vs. EPF10K200SFC484-3N (-3 faster grade))
- 369 user I/Os for high-density glue logic (vs. EPF10K100EFC484-2X (smaller die, same BGA))
Designhinweise
Estimated: At 250 MHz internal toggle rate with all 369 I/Os switching 5 pF loads, the EPF10K200SFC484-2X draws approximately 0.5 to 1.0 A from the 2.5 V core supply. Provide at least one 100 uF tantalum plus ten 0.1 uF ceramic decoupling capacitors distributed around the BGA periphery; the 5 V VCCIO banks each need their own 10 uF + 0.1 uF pair. Use a low-impedance power plane (4 oz copper recommended) on inner layers, and isolate digital returns from analog references if mixing with mixed-signal peripherals.
The 484-FBGA has a thermal resistance theta_JA of approximately 18 C/W (estimated, with 4-layer JEDEC board and adequate via array under the thermal pad). At full I/O toggle and 250 MHz internal, the device dissipates up to 2.5 W (estimated), yielding a junction temperature rise of 45 C above ambient - acceptable for commercial-grade 70 C operation but tight for industrial 85 C environments. Place a thermal via array (0.3 mm pitch, filled-and-capped) directly under the package thermal pad to the inner ground plane for maximum heat extraction.
The 484-BGA uses 1.0 mm ball pitch on a 23 x 23 mm body - achievable on standard 4-layer FR-4 with 4 mil trace/space using microvia or sub-4 mil HDI stack-ups. Escape routing requires two rows of signal vias between adjacent balls; plan escape channels for high-fanout nets (global clocks, configuration pins) early in the stack-up. Keep all configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) on the same BGA quadrant as the configuration device to minimize stub length.
Do not assume the EPF10K200SFC484-2X is in production - it is NRND and only authorized aftermarket channels (Rochester Electronics) hold stock. Do not use the MAX II EPM240 or Cyclone configuration bitstream formats; FLEX 10K uses its own .sof/.pof format generated by Quartus II 13.0 or earlier. Do not exceed VCCIO above 3.6 V when driving 3.3 V PCI-compliant signals, even though the part is 5 V tolerant. Always terminate JTAG TCK with a 50 ohm series resistor at the source end to prevent ringing.
Compliance-Informationen
The -X suffix denotes lead-free ball finish, consistent with RoHS compliance. REACH and halogen-free status were not explicitly stated in the verified web data; conflict-minerals compliance assumed for legacy Intel/Altera FPGAs.