EPF10K200SFI672-2 vs EPF10K200EFC672-3 Vergleich

Detaillierter Direktvergleich von EPF10K200SFI672-2 von Intel und EPF10K200EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SFI672-2 EPF10K200EFC672-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $99,50 $115,00
Family FLEX 10KE —
Logic Elements 9984 —
System Gates 200000 —
Logic Array Blocks (LABs) 1248 —
User I/Os 470 —
Embedded Array Blocks (EABs) 24 —
Embedded Memory (EAB SRAM) 96 Kbit —
Distributed Memory 98304 bits —
Process Technology 0.22 µm (Arrow lists 0.42 µm) 0.22 µm CMOS
Core Supply Voltage 2.5 V —
Gehäuse 672-pin FineLine BGA (FBGA) —
Speed Grade -2 —
Betriebstemperatur Industrial (-40C to +85C) 0 °C to +70 °C (commercial)
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade —
Programming SRAM-based, in-system programmable —
RoHS-Status Not compliant (per Arrow EU RoHS listing) [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Gehäuse / Bauform — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Montageart — Surface Mount
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL-Level — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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