EPF10K20RC208-3N vs EPF10K20RC208-4N Vergleich
Detaillierter Direktvergleich von EPF10K20RC208-3N von Intel und EPF10K20RC208-4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K20RC208-3N | EPF10K20RC208-4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,95 | $19,95 |
| Series | FLEX-10K | FLEX 10K |
| Family | FLEX 10K | Embedded Programmable Logic Device (EPLD) |
| Logic Elements / Cells | 1152 | — |
| Number of LABs/CLBs | 144 | — |
| Total RAM Bits | 12288 | — |
| Number of Gates | 20000 (typical), 63000 (max) | — |
| Number of I/O | 147 | — |
| Betriebsversorgungsspannung | 4.75 V to 5.25 V (5 V typical) | — |
| Maximum Operating Frequency | 125 MHz | — |
| Propagation Delay | 0.4 ns (tpd) | — |
| Process Technology | 0.42 µm CMOS | — |
| Betriebstemperatur | 0°C to 70°C (Commercial) | 0 °C to +70 °C (commercial) |
| Gehäuse | 208-BFQFP Exposed Pad (RQFP) | 208-BFQFP (RQFP) with exposed pad, 28 x 28 mm |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -3 | -4 (0.6 ns typical propagation delay) |
| Configuration Method | SRAM-based, ByteBlaster/BitBlaster compatible | — |
| Lead Free / RoHS | Lead free; RoHS status varies by date code | — |
| Typical Gates | — | 20,000 |
| Logic Cells | — | 1,152 |
| Logic Array Blocks (LABs) | — | 144 |
| Embedded Array Blocks (EABs) | — | 12 |
| Embedded Memory | — | 12,288 bits |
| User I/O Pins | — | 147 |
| Anzahl der Pins | — | 208 |
| Versorgungsspannung | — | 4.75 V to 5.25 V (5 V nominal) |
| Technology | — | 0.42 µm CMOS, SRAM-based configuration |
| Configuration Interface | — | JTAG / ByteBlaster |
| RoHS-Status | — | Compliant (Pb-free, 'N' suffix) |
| Lead-Free | — | Yes |