EPF10K250EFC672-1 vs EPF10K200EFC672-3 Vergleich

Detaillierter Direktvergleich von EPF10K250EFC672-1 von Intel und EPF10K200EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K250EFC672-1 EPF10K200EFC672-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $115,00 $115,00
Family FLEX 10KE —
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm —
Package Shape Square —
Terminal Form Ball —
Betriebstemperatur 0C to +70C (Commercial) 0 °C to +70 °C (commercial)
Propagation Delay 0.4 ns 0.4 ns
Programming Technology In-system, SRAM-based —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
Montageart Surface Mount Surface Mount
Configuration Interface Serial (passive/active) —
Speed Grade -1 —
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Process Technology — 0.22 µm CMOS
Maximum Operating Frequency — 166.67 MHz
Gehäuse / Bauform — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL-Level — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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