EPF10K250EFC672-3 vs EPF10K200EFC672-3 Vergleich
Detaillierter Direktvergleich von EPF10K250EFC672-3 von Intel und EPF10K200EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteSpezifikationsvergleich
| Parameter | EPF10K250EFC672-3 | EPF10K200EFC672-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $99,50 | $115,00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | — |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial (0C to +70C) | — |
| Gehäuse | 672-ball FineLine BGA (FC) | — |
| Ball Pitch | 1.0 mm | — |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | 0.22 µm CMOS |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | [DATA_NEEDED: rohs status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Gehäuse / Bauform | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Betriebstemperatur | — | 0 °C to +70 °C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL-Level | — | [DATA_NEEDED: MSL level] |