EPF10K250EFC672-3 vs EPF10K200EFC672-3 Comparaison
Comparaison détaillée côte à côte de EPF10K250EFC672-3 par Intel et EPF10K200EFC672-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteComparaison des spécifications
| Paramètre | EPF10K250EFC672-3 | EPF10K200EFC672-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $99,50 | $115,00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | — |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial (0C to +70C) | — |
| Boîtier | 672-ball FineLine BGA (FC) | — |
| Ball Pitch | 1.0 mm | — |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | 0.22 µm CMOS |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | [DATA_NEEDED: rohs status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Boîtier / Format | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Température de fonctionnement | — | 0 °C to +70 °C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |