EPF10K250EFI672-3 vs EPF10K250EFC672-3 Vergleich

Detaillierter Direktvergleich von EPF10K250EFI672-3 von Intel und EPF10K250EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K250EFI672-3 EPF10K250EFC672-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $125,00 $99,50
Family FLEX 10KE FLEX 10KE
Typical Gates 250,000 —
Logic Elements [DATA_NEEDED: exact LE count] —
User I/O Pins 470 470
Embedded Array Blocks (EABs) 12 —
EAB Dual-Port Width Up to 16-bit —
Maximum EAB Memory [DATA_NEEDED: bits per EAB] —
Propagation Delay (tpd) 0.4 ns (typical, -3 speed grade) —
Core Supply Voltage 2.5 V 2.5 V
I/O Supply Voltage 2.5 V / 3.3 V (multiVolt I/O) MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Gehäuse 672-ball FineLine BGA, 1.27 mm pitch 672-ball FineLine BGA (FC)
Process Technology CMOS, SRAM-based configuration 0.25 um CMOS, 5-layer metal
Configuration Interface JTAG / ByteBlaster (EPC2/EPC8 PROM) —
Betriebstemperatur 0 °C to 70 °C (commercial) —
Design Entry EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog —
RoHS-Status Unknown (legacy Altera non-RoHS device) [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
Speed Grade — -3 (fastest)
Temperature Grade — Commercial (0C to +70C)
Ball Pitch — 1.0 mm
Configuration Mode — JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Montageart — Surface Mount
Lead-Free — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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