EPF10K30EFC256-1 vs EPF10K30EFC256-1X Vergleich
Detaillierter Direktvergleich von EPF10K30EFC256-1 von Intel und EPF10K30EFC256-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoleteSpezifikationsvergleich
| Parameter | EPF10K30EFC256-1 | EPF10K30EFC256-1X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $69,50 | $95,60 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total RAM Bits | 24,576 | — |
| Typical Gates | 30,000 | 30,000 |
| Number of I/O | 176 | — |
| Number of Logic Gates | 119,000 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Betriebstemperatur | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Montageart | Surface Mount | — |
| Gehäuse / Bauform | 256-FBGA (17 x 17 mm, 1 mm pitch) | — |
| Supplier Device Package | 256-FBGA | — |
| Speed Grade | -1 | -1X (fastest commercial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| RoHS-Status | Compliant (verify per lot) | — |
| Logic Elements | — | 1728 |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded Memory (EAB RAM) | — | 24,576 bits (6 EABs of 4 Kbit each) |
| User I/O | — | 176 |
| Maximum Internal Frequency | — | 250 MHz |
| Propagation Delay (tpd) | — | 0.4 ns to 0.6 ns |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V / 3.3 V / 5 V |
| Gehäuse | — | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Phase-Locked Loops | — | 4 |
| Compliance | — | RoHS (check distributor for specific lot), Pb-free option available |