EPF8282ATC100-3 vs EPF8282ALC84-2 Vergleich

Detaillierter Direktvergleich von EPF8282ATC100-3 von Intel und EPF8282ALC84-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF8282ATC100-3 EPF8282ALC84-2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,25 $8,95
Family FLEX 8000 FLEX 8000
Logic Cells (LEs) 208 —
Usable Gates 2,500 2,500
Typical Gates Equivalent 12,000 —
Maximum User I/O 78 —
Number of Logic Array Blocks (LABs) 26 —
Embedded Array Blocks (EABs) 6 —
Total RAM Bits 12 Kbits —
Process Technology 0.42 micron CMOS SRAM 0.42 micrometer CMOS, SRAM-based
Supply Voltage (Core) 5 V —
MultiVolt I/O Support 3.3 V / 5 V —
Maximum Frequency 125 MHz —
Speed Grade -3 -2
Gehäuse 100-pin TQFP (100-TQFP) 84-pin LCC (J-Lead), PLCC-84
Configuration Method SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor External configuration device (EPC1/EPC1441) or JTAG
Operating Temperature (Commercial) 0 C to +70 C —
In-Circuit Reconfigurable Yes (ICR) —
Boundary Scan JTAG IEEE 1149.1 —
Device Logic Elements / FFs — 208
Logic Array Blocks (LABs) — 26
Maximum User I/Os — 68
Core Supply Voltage — 5.0 V
In-Circuit Reconfigurability — Yes (ICR)
JTAG Support — IEEE 1149.1 boundary-scan
Temperature Grade (this part) — Commercial (suffix 'C' in package code)
RoHS-Status — Unknown (legacy Altera part, pre-RoHS transition)
Lead-Free — Unknown
Montageart — Surface Mount (J-Lead)

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