EPF8282ATI100-3S vs EPF8282ATC100-2 Vergleich
Detaillierter Direktvergleich von EPF8282ATI100-3S von Intel und EPF8282ATC100-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF8282ATI100-3S - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel / Altera
EPF8282ATI100-3S NrndSpezifikationsvergleich
| Parameter | EPF8282ATI100-3S | EPF8282ATC100-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $14,50 | $9,75 |
| Family | FLEX 8000 | FLEX 8000 |
| Device Logic Elements / Cells | 208 | — |
| Number of LABs/CLBs | 26 | — |
| Number of Logic Elements / Cells | 208 | — |
| Total RAM Bits | [DATA_NEEDED: embedded RAM bits] | — |
| Number of I/O | 78 | — |
| Number of Gates | 2500 | — |
| Voltage - Supply | 5 V | — |
| Betriebstemperatur | -40C to +85C (industrial, I grade) | 0 °C to 70 °C (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 100-TQFP | — |
| Supplier Device Package | 100-TQFP | — |
| Speed Grade | -3 | -2 |
| Maximum Toggle Frequency | 125 MHz | — |
| Architecture | SRAM-based, in-circuit reconfigurable (ICR) | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Process Technology | CMOS | 0.42 µm CMOS |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Usable Gates | — | 2,500 |
| Logic Cells | — | 208 |
| Logic Array Blocks (LABs) | — | 26 |
| User I/Os | — | 78 |
| Flip-Flops | — | 282 |
| Versorgungsspannung | — | 5 V |
| Gehäuse | — | 100-pin TQFP |
| Configuration Memory | — | SRAM (volatile, requires external boot) |
| Development Tool | — | Altera MAX+PLUS II |