EPM2210F256C4N vs EPM2210F256C3N Vergleich
Detaillierter Direktvergleich von EPM2210F256C4N von Intel und EPM2210F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C4N | EPM2210F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $39,85 | $47,10 |
| Family | MAX II | — |
| Device Type | CPLD | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | 8 Kbits |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 um flash CMOS |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Betriebstemperaturbereich | 0 °C to +85 °C (Commercial) | — |
| Gehäuse | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant (per DigiKey product page) |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Programmable Type | — | In System Programmable (JTAG, IEEE 1149.1) |
| Macrocells | — | 1700 |
| Logic Elements / Blocks | — | 2210 |
| Number of User I/Os | — | 204 |
| Maximum Propagation Delay (tPD) | — | 7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| Internal Supply Voltage | — | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Betriebs-Sperrschichttemperatur | — | 0 C to 85 C (commercial, TJ suffix 'C') |
| MSL-Level | — | 3 (per JEDEC J-STD-020, typical for FBGA) |