EPM2210F256C4N vs EPM2210F256C3N 对比
详细并排对比 EPM2210F256C4N 出自 Intel 和 EPM2210F256C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM2210F256C4N | EPM2210F256C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $39.85 | $47.10 |
| Family | MAX II | — |
| Device Type | CPLD | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | 8 Kbits |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 um flash CMOS |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| 工作温度范围 | 0 °C to +85 °C (Commercial) | — |
| 封装 | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant (per DigiKey product page) |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Programmable Type | — | In System Programmable (JTAG, IEEE 1149.1) |
| Macrocells | — | 1700 |
| Logic Elements / Blocks | — | 2210 |
| Number of User I/Os | — | 204 |
| Maximum Propagation Delay (tPD) | — | 7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| Internal Supply Voltage | — | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| 工作结温 | — | 0 C to 85 C (commercial, TJ suffix 'C') |
| MSL 等级 | — | 3 (per JEDEC J-STD-020, typical for FBGA) |