EPM2210F256C5N vs EPM2210F256C4N Vergleich
Detaillierter Direktvergleich von EPM2210F256C5N von Intel und EPM2210F256C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C5N | EPM2210F256C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,85 | $39,85 |
| Family | MAX II | MAX II |
| Logic Elements | 2210 | — |
| Macrocells | 1700 | — |
| User I/Os | 204 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Propagation Delay (tPD) | 7 ns | — |
| Turn-On Delay (tSU) | 11.2 ns | — |
| Maximum Internal Frequency | 201.1 MHz | 247.5 MHz |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.18 um CMOS with on-chip flash | 0.18 µm |
| Global Clocks | 4 | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 256-ball FineLine BGA (17x17mm, 1mm pitch) | 256-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster | JTAG IEEE Std. 1149.1 + ISP |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Device Type | — | CPLD |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| User Flash Memory | — | 204 Kbit |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| Core Supply Voltage | — | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Betriebstemperaturbereich | — | 0 °C to +85 °C (Commercial) |