EPM2210GF324C4N vs EPM2210GF324I5N Vergleich
Detaillierter Direktvergleich von EPM2210GF324C4N von Intel und EPM2210GF324I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210GF324C4N | EPM2210GF324I5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,60 | $42,00 |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | 2210 |
| Equivalent Macrocells | 1,700 | 1700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm 6-layer-metal flash |
| Gehäuse | 324-ball FineLine BGA (GF324) | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | — |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| RoHS-Status | Compliant | — |
| Device Family | — | MAX II |
| User I/O | — | 272 |
| Propagation Delay (tPD) | — | 7 ns |
| Montageart | — | Surface Mount |
| Core Voltage (VCCINT) | — | 1.8 V (typical) |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Betriebstemperatur | — | -40 °C to +100 °C (TJ) |
| Programmability | — | In-System Programmable (JTAG / ISP) |
| Lead Free / RoHS | — | Yes (RoHS compliant) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |