EPM2210GF324I5N - MAX II CPLD, 2210 LE, 272 I/O, 324-FBGA | Intel
Teilenummer: EPM2210GF324I5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $70.79 | $70,79 |
| 10 | $65 | $650,00 |
| 100 | $55 | $5.500,00 |
| 500 | $47 | $23.500,00 |
| 1.000 | $42 | $42.000,00 |
EPM2210GF324I5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a programmable interconnect matrix, sitting hierarchically between simple SPLDs and higher-density FPGAs. MAX II devices specifically target glue-logic, interface bridging, power-up sequencing, and I/O expansion roles where instant-on non-volatile behavior, low standby current, and high I/O count matter more than raw logic density. They retain configuration on power loss without an external boot PROM, which is a key architectural advantage over SRAM-based FPGAs in cost-sensitive and rugged designs.
The EPM2210GF324I5N offers 272 user I/O, 2210 logic elements, an 8 Kbit UFM block, MultiVolt I/O supporting 1.5 V / 1.8 V / 2.5 V / 3.3 V interfaces, enhanced in-system programmability (ISP) via JTAG, and a fast tPD propagation delay suitable for high-speed control-plane glue logic. These differentiating features allow a single device to consolidate what would otherwise require multiple 74-series logic packages, lowering BOM cost and PCB area.
Architecturally, the EPM2210GF324I5N is built on a 0.18 µm 6-layer-metal flash process, integrating four Logic Array Blocks (LABs) interconnected by a MultiTrack interconnect fabric. Each LAB contains 16 Logic Elements (LEs) with 4-input look-up tables, programmable registers, and a product-term matrix supporting both combinatorial and registered logic. The flash-based configuration cell provides instant-on (< 1 ms) wake-up, eliminating the configuration time penalty of SRAM FPGAs. The integrated UFM block can store user data such as serial numbers, calibration constants, or bootloader code, replacing an external EEPROM in many designs.
Typical applications include digital design glue logic, timing control and reset sequencing, custom shift registers, parity generators, state machine controllers, bus interface bridging (e.g., 8-bit to 32-bit, SPI to parallel, I2C to GPIO), LED display drivers, industrial control panels, and consumer electronics I/O expansion. The 272 I/O count makes it well-suited to high-pin-count bridging tasks.
When designing with this device, ensure the JTAG chain is correctly terminated with the TCK TMS TDI TDO pull-resistor scheme recommended in the MAX II handbook. Decoupling requires at least one 0.1 µF ceramic capacitor per VCCIO/VCCINT pin group placed within 5 mm of the BGA ball, plus bulk 10 µF tantalum or ceramic capacitors on each supply rail. Because the FBGA-324 package has a 1.0 mm pitch, reflow profile must comply with JEDEC J-STD-020 MSL3 or better, and PCB land patterns should follow the FineLine BGA recommended footprint with non-solder-mask-defined (NSMD) pads.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical FBGA-324 layout notes not found in a single manufacturer datasheet, and is structured for engineers who need to compare and qualify a MAX II CPLD for production.
Drop-in-Alternativen für EPM2210GF324I5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM2210GF324I5N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, RoHS Status, Operating Temperature, Equivalent Macrocells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM2210GF324I5
✅ Drop-In✓ Auf Lager
$28.95 / Stück
Datenblatt ansehen →EPM2210GF324C5N
✅ Drop-In✓ Auf Lager
$17.9 / Stück
Datenblatt ansehen →EPM2210GF324C5
✅ Drop-In✓ Auf Lager
$13.6 / Stück
Datenblatt ansehen →EPM2210GF324C4N
✅ Drop-In✓ Auf Lager
$25.6 / Stück
Datenblatt ansehen →EPM2210GF324I5N Grenzwerte & elektrische Eigenschaften
| Device Family | MAX II |
| Logic Elements | 2210 |
| Equivalent Macrocells | 1700 |
| User I/O | 272 |
| Propagation Delay (tPD) | 7 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Gehäuse | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Montageart | Surface Mount |
| Core Voltage (VCCINT) | 1.8 V (typical) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Betriebstemperatur | -40 °C to +100 °C (TJ) |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Programmability | In-System Programmable (JTAG / ISP) |
| Lead Free / RoHS | Yes (RoHS compliant) |
EPM2210GF324I5N 324-ball fineline bga (fbga-324), 19 x 19 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EPM2210GF324I5N (324-ball fineline bga (fbga-324), 19 x 19 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM2210GF324I5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM2210GF324I5N ist geeignet für 6 Anwendungs: Digital Design Glue Logic, Bus Interface Bridging, Power-Up Sequencing and Reset Control, State Machine Controllers, LED Display and Sign Drivers, Industrial Control Panel I/O Expansion.
Digital Design Glue Logic
The EPM2210GF324I5N consolidates multiple 74-series logic packages into a single non-volatile CPLD, reducing PCB area and BOM cost. Its 2210 logic elements (1700 macrocells) and 272 user I/O comfortably absorb address decoding, chip-select generation, and bus control functions across an entire system. With a 7 ns propagation delay, the device suits glue-logic paths running at 50 to 100 MHz, and the 1.8 V core plus MultiVolt I/O at 1.5 V / 1.8 V / 2.5 V / 3.3 V lets one part bridge 3.3 V MCUs to 1.8 V peripherals without external level shifters. Instant-on flash-based configuration removes the boot PROM typically needed by SRAM FPGAs.
Empfohlen
Bus Interface Bridging
The EPM2210GF324I5N excels at bridging mismatched buses (e.g., 8-bit to 32-bit, SPI to parallel, I2C to GPIO) thanks to its 272 user I/O and configurable MultiVolt I/O banks. Per the MAX II datasheet, the device supports multiple I/O standards including LVCMOS, LVTTL, and PCI on the same die, eliminating external translator ICs. With 2210 logic elements and 7 ns tPD, it can run parallel-to-parallel width converters or custom serializer/deserializer blocks up to approximately 100 MHz, making it a strong fit for legacy-to-modern interface adaptation in industrial and embedded designs.
Empfohlen
Power-Up Sequencing and Reset Control
The EPM2210GF324I5N is widely used as a power-sequencing controller, generating accurate delays and watchdog resets for multi-rail systems. With 2210 logic elements, designers can implement sequenced enables for 3 to 8 voltage rails, configurable via JTAG, while the on-chip 8 Kbit User Flash Memory stores rail-by-rail timing parameters. The industrial -40 °C to +100 °C temperature range ensures reliable startup behavior in cold or hot environments. Compared to discrete RC-delay or timer-IC sequencing, the EPM2210GF324I5N offers reprogrammability, tighter timing accuracy, and consolidation of watchdog, brownout, and reset-stretch functions in one part.
Empfohlen
State Machine Controllers
The EPM2210GF324I5N implements complex state machines, parity generators, and custom shift registers in a single non-volatile device. Its 1700 macrocells with 4-input LUTs and product-term logic support both Mealy and Moore machines, while the 8 Kbit UFM can hold state-transition tables or calibration data. With 272 I/O, designers can monitor and control dozens of inputs and outputs simultaneously. Per the MAX II family datasheet, the device achieves 7 ns tPD allowing state transitions above 100 MHz, and JTAG-based in-system programmability enables field updates without removing the part from the board.
Empfohlen
LED Display and Sign Drivers
The EPM2210GF324I5N drives large LED matrices and seven-segment displays, leveraging 272 user I/O to control rows, columns, and brightness modulation. Per the MAX II datasheet, the device supports 3.3 V LVCMOS outputs at 24 mA drive strength, sufficient to sink or source LED segments directly without external transistors. The 2210 logic elements allow per-row PWM generation for dimming, while the 8 Kbit UFM stores lookup tables for character fonts or animation patterns. The -40 °C to +100 °C temperature range covers outdoor signage, transportation displays, and industrial indicator panels.
Empfohlen
Industrial Control Panel I/O Expansion
The EPM2210GF324I5N expands microcontroller GPIO by adding 272 reconfigurable I/O with custom logic in between, ideal for PLCs, HMI panels, and industrial controllers. The MultiVolt I/O supports direct connection to 24 V tolerant logic via external resistors, and the -40 °C to +100 °C industrial temperature rating meets IEC 61131-2 environmental requirements for factory floor equipment. Per the MAX II datasheet, the 7 ns tPD enables fast interrupt aggregation and encoder decoding, while the integrated 8 Kbit UFM can store device ID or calibration data per panel.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM2210GF324I5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM2210GF324I5 | EPM2210GF324C5N | EPM2210GF324C5 | EPM2210GF324C4N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 324-ball FBGA (FineLine BGA) | 324-ball FBGA (FineLine BGA) - same | 324-ball FBGA (FineLine BGA) - same | 324-ball FBGA (FineLine BGA) - same | 324-ball FBGA (FineLine BGA) - same |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 |
| User I/O | 272 | 272 | 272 | 272 | 272 |
| Propagation Delay (tPD) | 7 ns (I5 speed grade) | 7 ns | 7 ns | 7 ns | 8.7 ns (C4 speed grade) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| RoHS / Lead-Free | Yes (RoHS compliant) | No (legacy) | Yes | No (legacy) | Yes |
| Packaging Form | Tray | Tape and Reel | Tray | Tape and Reel | Tray |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Wichtigste Unterscheidungsmerkmale
- Highest I/O count in the MAX II family with 272 user I/O (vs. EPM1270F256C5N)
- Industrial temperature range -40C to +100C TJ (vs. EPM2210GF324C5N)
- RoHS-compliant lead-free tray packaging (vs. EPM2210GF324I5)
Designhinweise
The EPM2210GF324I5N is housed in a 324-ball FineLine BGA at 19 x 19 mm with 1.0 mm pitch. Use NSMD (non-solder-mask-defined) pads with a 0.45 mm diameter and a 1.0 mm pitch to match the Altera footprint recommendation. PCB land pattern should follow IPC-7351 naming conventions for FineLine BGA, and the reflow profile must comply with JEDEC J-STD-020. Place at least one 0.1 µF ceramic decoupling capacitor within 5 mm of every VCCINT and VCCIO ball, plus one 10 µF bulk capacitor per supply rail.
The MAX II device supports MultiVolt I/O with banks that can be powered independently at 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Group the I/O banks in Quartus Prime assignments to match the PCB power plane partitions. Route JTAG signals TCK, TMS, TDI, TDO away from high-speed switching traces, and add 4.7 kΩ pull-ups on TCK, TMS, TDI and a 4.7 kΩ pull-up on TDO as recommended in the MAX II handbook. Place the JTAG header within 50 mm of the device to minimize signal-integrity issues.
Do not exceed the absolute maximum VCCINT of 1.95 V or VCCIO of 4.0 V. Ensure all unused I/O pins are configured as outputs driving ground or as inputs with internal pull-ups enabled, per the MAX II datasheet. When migrating from EPM1270 to EPM2210 in the same 256/324-FBGA footprint, verify that the JTAG chain termination matches the new device's IDCODE; otherwise, JTAG programming will fail silently. Also confirm that the UFM block is not used simultaneously as a scratchpad and a bootloader source.
Estimated: the EPM2210GF324I5N at 1.8 V core and maximum toggle activity dissipates approximately 0.5 W typical and up to 1.0 W worst-case. With the 324-FBGA thermal pad design and the recommended PCB footprint, theta_JA is approximately 25 C/W on a 4-layer 2 oz copper PCB, resulting in a junction temperature rise of 25 C above ambient. The 100 C maximum junction temperature allows operation up to 75 C ambient without active cooling, but in enclosed industrial cabinets above 60 C, provide airflow or copper heatsink planes.
Compliance-Informationen
RoHS compliance is indicated by the N suffix in the part number per Altera/Intel ordering information. AEC-Q100 automotive qualification is not applicable for MAX II CPLDs in this density range.
