EPM3512AFC256-2N vs EPM3512AFC256-22 Vergleich
Detaillierter Direktvergleich von EPM3512AFC256-2N von Intel und EPM3512AFC256-22 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM3512AFC256-2N | EPM3512AFC256-22 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,80 | $16,10 |
| Family | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 |
| Logic Array Blocks (LABs) | 32 | 16 |
| Maximum User I/O Pins | 212 | 208 (typical for FC256 package) |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | 22 ns |
| Maximum Operating Frequency | [DATA_NEEDED: fMAX in MHz] | — |
| Process Technology | 0.30 µm CMOS EEPROM | — |
| Configuration Memory | Non-volatile EEPROM | On-chip EEPROM (non-volatile) |
| In-System Programmability | IEEE Std. 1532 JTAG | — |
| VCCINT (Core Supply) | 3.3 V | — |
| VCCIO (I/O Supply) | 2.5 V / 3.3 V / 5.0 V MultiVolt | — |
| PCI Compliance | 3.3 V PCI-compliant | — |
| Gehäuse | 256-ball FineLine BGA (FC-256) | FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch) |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Speed Grade | — | -22 (tPD ~22 ns) |
| Supply Voltage VCCINT | — | 3.3 V |
| I/O Standards Supported | — | 2.5 V, 3.3 V, 5.0 V (VCCIO selectable) |
| In-System Programming | — | IEEE Std. 1532-compliant ISP via JTAG |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature grade] |