EPM570F256C3N vs EPM570F256C5N Vergleich
Detaillierter Direktvergleich von EPM570F256C3N von Intel und EPM570F256C5N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C3N | EPM570F256C5N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,75 | $17,03 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 um |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | 160 |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1), in-system |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level not stated in provided data] | — |
| RoHS-Status | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Logic Elements | — | 570 |
| Number of Macrocells | — | 440 |
| Internal Supply Voltage | — | 2.5 V / 3.3 V |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| User Flash Memory | — | 8 Kbits |
| Program Memory Type | — | Non-volatile Flash |
| MultiVolt I/O Support | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Betriebstemperatur | — | 0C to 85C (TJ) |