EPM570F256C3N vs EPM570ZF256C7N Vergleich
Detaillierter Direktvergleich von EPM570F256C3N von Intel und EPM570ZF256C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C3N | EPM570ZF256C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,75 | $17,85 |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 201 MHz (internal) |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm flash-based CMOS |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Gehäuse | 256-ball FBGA (FineLine BGA) | — |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level not stated in provided data] | — |
| RoHS-Status | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Programmable Type | — | In System Programmable |
| Macro Cells | — | 440 |
| Logic Elements (LE) | — | 440 |
| Embedded Flash Memory | — | 8 Kbit |
| Pin-to-Pin Logic Delay (tPD) | — | 9 ns |
| Maximum User I/O Pins | — | 160 |
| Supply Voltage - Internal (VCCINT) | — | 1.71 V to 1.89 V |
| I/O Bank Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Supplier Device Package | — | 256-MBGA (11x11 mm) |
| Package Type Code | — | 256-FBGA / 256-TFBGA |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperaturbereich | — | 0 °C to +85 °C (commercial, suffix 'C') |
| Lead-Free Status | — | Lead free |