EPM570F256C3N vs EPM570ZF256C7N Comparación
Comparación detallada lado a lado de EPM570F256C3N por Intel y EPM570ZF256C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570F256C3N | EPM570ZF256C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13,75 | $17,85 |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 201 MHz (internal) |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm flash-based CMOS |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Encapsulado | 256-ball FBGA (FineLine BGA) | — |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Estado RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Programmable Type | — | In System Programmable |
| Macro Cells | — | 440 |
| Logic Elements (LE) | — | 440 |
| Embedded Flash Memory | — | 8 Kbit |
| Pin-to-Pin Logic Delay (tPD) | — | 9 ns |
| Maximum User I/O Pins | — | 160 |
| Supply Voltage - Internal (VCCINT) | — | 1.71 V to 1.89 V |
| I/O Bank Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Supplier Device Package | — | 256-MBGA (11x11 mm) |
| Package Type Code | — | 256-FBGA / 256-TFBGA |
| Ball Pitch | — | 1.0 mm |
| Rango de temperatura de funcionamiento | — | 0 °C to +85 °C (commercial, suffix 'C') |
| Lead-Free Status | — | Lead free |