EPM570F256C4N vs EPM570F256C3N Vergleich
Detaillierter Direktvergleich von EPM570F256C4N von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C4N | EPM570F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $26,85 | $13,75 |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Gehäuse | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um, 6-layer-metal flash CMOS |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Betriebstemperaturbereich | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant (per DigiKey listing) |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Programming Interface | — | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| MSL-Level | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |