EPM570GM256I5N vs EPM570GM256C5N Vergleich

Detaillierter Direktvergleich von EPM570GM256I5N von Intel und EPM570GM256C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPM570GM256I5N EPM570GM256C5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $21,40 $18,60
Device Family MAX II —
Series MAX II G MAX II
Logic Elements (LE) 570 —
Macrocells 440 —
User I/Os 160 —
Propagation Delay (tpd) 5.4 ns (max) —
Internal Supply Voltage 1.71 V to 1.89 V —
User Flash Memory (UFM) 8 Kbits —
Programmable Type In-System Programmable (ISP) In System Programmable (ISP) via JTAG
Betriebstemperatur -40 C to +100 C (TJ, industrial) 0 °C to +85 °C (commercial)
Package Type 256-TFBGA (MBGA), 11x11 mm —
Montageart Surface Mount —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
JTAG / Boundary Scan IEEE 1149.1 compliant —
Process Technology 6-layer-metal flash CMOS 0.18 um flash-based CMOS
Family — CPLD - Complex Programmable Logic Device
Macro Cells — 440
Logic Array Blocks (LABs) — 57
Number of I/Os — 160
Maximum Operating Frequency — 304 MHz
Maximum Internal Frequency (datasheet fMAX) — 201.1 MHz
Pin-to-Pin Logic Delay (Speed Grade C5) — 5 ns
Operating Supply Voltage (Core VCCINT) — 1.71 V to 1.89 V (1.8 V nominal)
I/O Bank Supply Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
Gehäuse / Bauform — 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch
Montagestil — SMD/SMT
Packaging — Tray
Lead Free / RoHS Status — See manufacturer page; legacy part - verify per lot
Configuration Memory — Internal flash (non-volatile, instant-on)
JTAG Support — Yes (IEEE 1149.1 / 1532)
Vertical Migration — Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package

Datenblätter & Ressourcen

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