EPM570GM256I5N vs EPM570GM256C5N 对比

详细并排对比 EPM570GM256I5N 出自 Intel 和 EPM570GM256C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570GM256I5N EPM570GM256C5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $21.40 $18.60
Device Family MAX II —
Series MAX II G MAX II
Logic Elements (LE) 570 —
Macrocells 440 —
User I/Os 160 —
Propagation Delay (tpd) 5.4 ns (max) —
Internal Supply Voltage 1.71 V to 1.89 V —
User Flash Memory (UFM) 8 Kbits —
Programmable Type In-System Programmable (ISP) In System Programmable (ISP) via JTAG
工作温度 -40 C to +100 C (TJ, industrial) 0 °C to +85 °C (commercial)
Package Type 256-TFBGA (MBGA), 11x11 mm —
安装类型 Surface Mount —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
JTAG / Boundary Scan IEEE 1149.1 compliant —
Process Technology 6-layer-metal flash CMOS 0.18 um flash-based CMOS
Family — CPLD - Complex Programmable Logic Device
Macro Cells — 440
Logic Array Blocks (LABs) — 57
Number of I/Os — 160
Maximum Operating Frequency — 304 MHz
Maximum Internal Frequency (datasheet fMAX) — 201.1 MHz
Pin-to-Pin Logic Delay (Speed Grade C5) — 5 ns
Operating Supply Voltage (Core VCCINT) — 1.71 V to 1.89 V (1.8 V nominal)
I/O Bank Supply Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
封装 / 外壳 — 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch
安装方式 — SMD/SMT
Packaging — Tray
Lead Free / RoHS Status — See manufacturer page; legacy part - verify per lot
Configuration Memory — Internal flash (non-volatile, instant-on)
JTAG Support — Yes (IEEE 1149.1 / 1532)
Vertical Migration — Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package

数据手册与资源

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