EPM570M256C4N vs EPM570GF256C4N Vergleich
Detaillierter Direktvergleich von EPM570M256C4N von Intel und EPM570GF256C4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ AktivSpezifikationsvergleich
| Parameter | EPM570M256C4N | EPM570GF256C4N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,31 | $9,45 |
| Family | MAX II | MAX II G |
| Device Logic Elements | 440 LE | — |
| Macro Cells | 440 | — |
| Maximum User I/Os | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Internal Performance (fMAX) | 247.5 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 µm CMOS | — |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| Gehäuse | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm | 256-ball FineLine BGA (FBGA-256) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | -40 °C to +125 °C | -40 °C to +125 °C (industrial) |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) | Lead-free, FBGA package |
| Logic Family | CMOS | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |