H5AN8G8NAFR-RDC vs H5AN8G8NAFR-UHI Vergleich
Detaillierter Direktvergleich von H5AN8G8NAFR-RDC von SK hynix und H5AN8G8NAFR-UHI von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5AN8G8NAFR-RDC | H5AN8G8NAFR-UHI |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,95 | $4,10 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| Speicherorganisation | 1G x 8 (x8) | 1G x 8 |
| Schnittstelle | DDR4 (Double Data Rate 4) | DDR4 (JEDEC-class) |
| Speed Grade | -RDC (DDR4-2666 class) | — |
| Datenrate | 2666 MT/s (per -R speed grade suffix) | DDR4-2400 (PC2400), 1200 MHz clock |
| Core Supply Voltage (VDD) | 1.2 V | — |
| I/O Supply Voltage (VDDQ) | 1.2 V | — |
| Wordline Supply (VPP) | 2.5 V | — |
| Banks / Bank Groups | 16 banks / 4 bank groups (DDR4 8Gb architecture) | — |
| Burst Length | 8 (BL8) | — |
| CAS-Latenz | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS latency for UHI speed grade] |
| Gehäuse | 78-ball FBGA | 78-ball FBGA |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature range] | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Halogenfrei | Yes | — |
| RoHS-Status | Compliant | Compliant |
| Datasheet Revision | Rev. 1.2 / Jul. 2017 | — |
| Memory Density | — | 8 Gb |
| Versorgungsspannung | — | 1.2 V |
| Lead Free | — | Yes |
| Halogenfrei | — | Yes |
| Technology | — | CMOS |
| Application | — | Main memory (high density, high bandwidth) |
| Refresh | — | [DATA_NEEDED: refresh specification] |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |