H5CG34MEBDX030 vs H5CG24AGBDX022 Vergleich

Detaillierter Direktvergleich von H5CG34MEBDX030 von SK hynix und H5CG24AGBDX022 von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ Aktiv
SK hynix
H5CG24AGBDX022 H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 ✓ Aktiv

Spezifikationsvergleich

Parameter H5CG34MEBDX030 H5CG24AGBDX022
Marke SK hynix SK hynix
Kategorie DRAM Memory ICs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,75 $0,00
Manufacturer SK hynix —
Product Family H5CG (DDR5 SDRAM) —
Speichertyp DDR5 SDRAM DDR5 SDRAM
Density [DATA_NEEDED: device density (Gb)] [DATA_NEEDED: die density (Gb)]
Speicherorganisation [DATA_NEEDED: x organization] [DATA_NEEDED: die organization (x8/x16)]
Speed Grade / Data Rate [DATA_NEEDED: MT/s speed bin] —
CAS Latency (CL) [DATA_NEEDED: CL value] —
Supply Voltage VDD [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)] 1.1 V (DDR5 nominal, per SK hynix DDR5 family)
Gehäuse FBGA (fine-pitch BGA), surface mount —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: commercial/industrial range]
On-die ECC Yes (DDR5 standard feature) —
Burst Length 16 (DDR5 standard) 16 (BL16, DDR5 standard)
Bank Groups [DATA_NEEDED: bank group count] —
Schnittstellentyp Parallel, DDR5 point-to-point DDR5 (DFE-based receiver)
RoHS-Status Compliant [DATA_NEEDED: RoHS compliance statement]
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Manufacturer Series — H5CG Series (SK hynix DDR5)
Speed Grade — [DATA_NEEDED: DDR5 speed bin (Mbps)]
Datenrate — [DATA_NEEDED: data transfer rate]
CAS-Latenz — [DATA_NEEDED: CL at rated speed bin]
Bank Count — 32 banks / 8 bank groups (DDR5 architecture)
ECC — On-die ECC (DDR5 standard feature)
Package Type — [DATA_NEEDED: FBGA ball count / package code]
JEDEC Standard — DDR5 SDRAM JEDEC standard compatible

Datenblätter & Ressourcen

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