IQE013N04LM6SCATMA1 vs IQE013N04LM6ATMA1 Vergleich
Detaillierter Direktvergleich von IQE013N04LM6SCATMA1 von Infineon und IQE013N04LM6ATMA1 von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Infineon
IQE013N04LM6SCATMA1 - 40V 1.35mΩ OptiMOS Source-Down MOSFET | Infineon
IQE013N04LM6SCATMA1 ✓ AktivInfineon
IQE013N04LM6ATMA1 - 40V 1.35mΩ OptiMOS N-FET, PQFN 3.3x3.3 | Infineon
IQE013N04LM6ATMA1 ✓ AktivSpezifikationsvergleich
| Parameter | IQE013N04LM6SCATMA1 | IQE013N04LM6ATMA1 |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,02 | $0,71 |
| FET Type | N-Channel | — |
| Technology | OptiMOS (trench MOSFET) | OptiMOS N-channel trench MOSFET |
| Drain-Source Voltage (V<sub>DS</sub>) | 40 V | — |
| Gate-Source Voltage (V<sub>GS</sub>) | ±20 V | — |
| R<sub>DS(on)</sub> max @ V<sub>GS</sub>=10 V | 1.35 mΩ | — |
| Continuous Drain Current (I<sub>D</sub>) at T<sub>A</sub>=25 °C | 31 A | — |
| Continuous Drain Current (I<sub>D</sub>) at T<sub>C</sub>=25 °C | [DATA_NEEDED: I_D at T_C] (per distributor listing 205 A pulsed) | — |
| Pulsed Drain Current (I<sub>DM</sub>) at T<sub>C</sub>=25 °C | 205 A | — |
| Power Dissipation (P<sub>D</sub>) at T<sub>A</sub>=25 °C | 2.5 W | — |
| Power Dissipation (P<sub>D</sub>) at T<sub>C</sub>=25 °C | 107 W | — |
| Total Gate Charge (Q<sub>G</sub>) @ V<sub>GS</sub>=10 V | 41 nC | — |
| Output Capacitance (C<sub>oss</sub>) @ V<sub>DS</sub>=20 V | 3800 pF | — |
| Gehäuse | PG-WHSON-8-1 (3.3 mm × 3.3 mm Source-Down PQFN) with exposed pad | PG-TSON-8-4 / PQFN 3.3x3.3 mm Source-Down |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | [DATA_NEEDED: T_J min/max] | -55 °C to +175 °C |
| RoHS-Status | Compliant | Compliant |
| Packaging | Tape & Reel | — |
| Part Family | OptiMOS Source-Down, 40 V, 3.3×3.3 PQFN | — |
| Polarity | — | N-Channel |
| Drain-Source Voltage (VDS) | — | 40 V |
| Gate-Source Voltage (VGS) | — | ±20 V |
| Continuous Drain Current (Ta) | — | 31 A |
| Continuous Drain Current (Tc) | — | 205 A |
| Power Dissipation (Ta) | — | 2.5 W |
| Power Dissipation (Tc) | — | 107 W |
| On-Resistance RDS(on) max | — | [DATA_NEEDED: RDS(on) max value at VGS=10V] |
| On-Resistance RDS(on) typ | — | 1.35 mΩ @ VGS=10 V, ID=20 A |
| Gate Threshold Voltage (VGS(th)) | — | 2 V (typ) |
| Source-Down Topology | — | Yes (flip-chip die attach, drain on top thermal pad) |