K3KCKC0BM-JGCT vs K3KL3L30QM-JGCT Vergleich
Detaillierter Direktvergleich von K3KCKC0BM-JGCT von Samsung Electronics und K3KL3L30QM-JGCT von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | K3KCKC0BM-JGCT | K3KL3L30QM-JGCT |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Speichertyp | LPDDR5 SDRAM | Volatile - DRAM |
| Density | 64 Gb | — |
| Schnittstelle | LPDDR5 (Low Power Double Data Rate 5) | — |
| Speicherorganisation | [DATA_NEEDED: organization (x32/x16)] | — |
| Package Type | FBGA (fine-pitch ball grid array) | — |
| Ball Count | [DATA_NEEDED: ball count] | [DATA_NEEDED: ball count] |
| Speed Grade Suffix | JGCT | — |
| Max Pin Speed (family reference K3LKCKC0BM-MGCP) | 6400 Mbps | — |
| Supply Voltage Core (VDD1) | [DATA_NEEDED: VDD1 voltage] | — |
| Supply Voltage I/O (VDD2/VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Montageart | Surface Mount | Surface Mount |
| Refresh Mode | Self-refresh with partial array self-refresh (PASR) | — |
| Power Features | DVFSC, deep power-down | — |
| RoHS-Status | unknown | [DATA_NEEDED: RoHS status] |
| Packaging | [DATA_NEEDED: packing type and standard quantity] | Plateau (tray style, per distributor data) |
| Technology | — | LPDDR5X |
| Speichergröße | — | 64 Gb |
| Memory Organization | — | x64 |
| Maximum Data Rate | — | 7500 Mbps/pin |
| Schnittstellentyp | — | Parallel LPDDR5X |
| Clock Rate | — | [DATA_NEEDED: clock rate] |
| Supply Voltage VDD | — | [DATA_NEEDED: VDD voltage] |
| Supply Voltage VDDQ | — | [DATA_NEEDED: VDDQ voltage] |
| Access Time / Latency | — | [DATA_NEEDED: CAS latency] |
| Gehäuse | — | [DATA_NEEDED: package code and dimensions] |
| Product Status | — | Sampling (per distributor data) |