K3LK4L40DM-BGCT vs MT40A512M8RH-075E:B Vergleich

Detaillierter Direktvergleich von K3LK4L40DM-BGCT von Samsung Electronics und MT40A512M8RH-075E:B von Micron Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Samsung Electronics
K3LK4L40DM-BGCT K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT ✓ Aktiv
Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ Aktiv

Spezifikationsvergleich

Parameter K3LK4L40DM-BGCT MT40A512M8RH-075E:B
Marke Samsung Electronics Micron Technology
Kategorie DRAM Memory ICs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $40,50 $2,15
Speichertyp DRAM (SDRAM component) DDR4 SDRAM
Manufacturer Samsung Electronics —
Density [DATA_NEEDED: Density] 4 Gbit
Organization (x-width) [DATA_NEEDED: Organization] —
Datenrate [DATA_NEEDED: Data Rate] 2666 MT/s (DDR4-2666)
Supply Voltage Class [DATA_NEEDED: Supply Voltage] —
CAS-Latenz [DATA_NEEDED: CAS Latency] —
Package Type BGA (per -BGC ordering-code suffix) —
Package Ball Count [DATA_NEEDED: Ball Count] —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: Operating Temperature Range] [DATA_NEEDED: operating temperature range (standard grade)]
Refresh Rate [DATA_NEEDED: Refresh Interval] —
RoHS-Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Lead Free [DATA_NEEDED: Lead-Free Status] —
MSL-Level [DATA_NEEDED: Moisture Sensitivity Level] —
Packaging Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] —
Speicherorganisation — 512M x 8
Clock Frequency — 1333 MHz (1.33 GHz)
VDD Supply Voltage — 1.2 V +/-60 mV
VDDQ Supply Voltage — 1.2 V +/-60 mV
VPP Supply Voltage — 2.5 V, -125 mV/+250 mV
Schnittstellentyp — Parallel
I/O Structure — 1.2V pseudo open-drain
Referenzspannung — On-die internal adjustable VREFDQ generation
Gehäuse — 78-FBGA (9 x 10.5 mm), TFBGA
Refresh — Refresh max interval extension at extended TC temperature range (125C capable per family features)
Speed Grade Suffix — -075E
Packaging Option Suffix — :B (ball map B designation per Mouser listing)

Datenblätter & Ressourcen

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