LPC1311FHN33,551 vs LPC1316FHN33,551 Vergleich
Detaillierter Direktvergleich von LPC1311FHN33,551 von NXP Semiconductors und LPC1316FHN33,551 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC1311FHN33,551 | LPC1316FHN33,551 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,24 | $0,82 |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 |
| Core Size | 32-Bit | 32-Bit |
| Max CPU Frequency | 72 MHz | 72 MHz |
| Flash Memory | 8 KB (8K x 8) | 48 KB (48K x 8) |
| SRAM | 2 KB | — |
| Supply Voltage Range | 2 V to 3.6 V | 2.5 V to 3.3 V |
| I/O Pins | 25 GPIO (up to 28 on family) | — |
| Communication Interfaces | I2C (Fast-mode plus), UART | — |
| Timers | 4 x General Purpose Timers | — |
| Package Type | HVQFN-33 (7 x 7 mm, 0.85 mm height) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | ACTIVE | — |
| Data Converters | [DATA_NEEDED: ADC specification] | — |
| Program Memory Type | FLASH | — |
| RoHS-Status | Compliant (per NXP standard product offering) | — |
| Supplier Device Package | 32-HVQFN (7x7) | — |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| Gehäuse | — | 32-HVQFN (7x7 mm) Exposed Pad |
| Series | — | LPC13xx (LPC1316) |
| USB Controller | — | USB device |
| Serial Interfaces | — | USART |
| Pipeline | — | 3-stage |
| Architecture | — | Harvard, with separate instruction and data buses |
| EEPROM Emulation | — | Yes (per LPC1316 family datasheet) |
| Packaging | — | Tray |