LPC1311FHN33,551 vs LPC1316FHN33,551 Comparaison
Comparaison détaillée côte à côte de LPC1311FHN33,551 par NXP Semiconductors et LPC1316FHN33,551 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | LPC1311FHN33,551 | LPC1316FHN33,551 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,24 | $0,82 |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 |
| Core Size | 32-Bit | 32-Bit |
| Max CPU Frequency | 72 MHz | 72 MHz |
| Flash Memory | 8 KB (8K x 8) | 48 KB (48K x 8) |
| SRAM | 2 KB | — |
| Supply Voltage Range | 2 V to 3.6 V | 2.5 V to 3.3 V |
| I/O Pins | 25 GPIO (up to 28 on family) | — |
| Communication Interfaces | I2C (Fast-mode plus), UART | — |
| Timers | 4 x General Purpose Timers | — |
| Package Type | HVQFN-33 (7 x 7 mm, 0.85 mm height) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | ACTIVE | — |
| Data Converters | [DATA_NEEDED: ADC specification] | — |
| Program Memory Type | FLASH | — |
| Statut RoHS | Compliant (per NXP standard product offering) | — |
| Supplier Device Package | 32-HVQFN (7x7) | — |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| Boîtier | — | 32-HVQFN (7x7 mm) Exposed Pad |
| Series | — | LPC13xx (LPC1316) |
| USB Controller | — | USB device |
| Serial Interfaces | — | USART |
| Pipeline | — | 3-stage |
| Architecture | — | Harvard, with separate instruction and data buses |
| EEPROM Emulation | — | Yes (per LPC1316 family datasheet) |
| Packaging | — | Tray |