LPC1316FHN33,551 vs LPC1311FHN33,551 Vergleich
Detaillierter Direktvergleich von LPC1316FHN33,551 von NXP Semiconductors und LPC1311FHN33,551 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC1316FHN33,551 | LPC1311FHN33,551 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,82 | $1,24 |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 |
| Core Size | 32-Bit | 32-Bit |
| Max CPU Frequency | 72 MHz | 72 MHz |
| Flash Memory | 48 KB (48K x 8) | 8 KB (8K x 8) |
| SRAM Size | [DATA_NEEDED: SRAM size] | — |
| Supply Voltage Range | 2.5 V to 3.3 V | 2 V to 3.6 V |
| Gehäuse | 32-HVQFN (7x7 mm) Exposed Pad | — |
| Montageart | Surface Mount | Surface Mount |
| Series | LPC13xx (LPC1316) | — |
| USB Controller | USB device | — |
| Serial Interfaces | USART | — |
| Pipeline | 3-stage | — |
| Architecture | Harvard, with separate instruction and data buses | — |
| EEPROM Emulation | Yes (per LPC1316 family datasheet) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| SRAM | — | 2 KB |
| I/O Pins | — | 25 GPIO (up to 28 on family) |
| Communication Interfaces | — | I2C (Fast-mode plus), UART |
| Timers | — | 4 x General Purpose Timers |
| Package Type | — | HVQFN-33 (7 x 7 mm, 0.85 mm height) |
| Life Cycle Stage | — | ACTIVE |
| Data Converters | — | [DATA_NEEDED: ADC specification] |
| Program Memory Type | — | FLASH |
| RoHS-Status | — | Compliant (per NXP standard product offering) |
| Supplier Device Package | — | 32-HVQFN (7x7) |