LPC1316FHN33,551 vs LPC1311FHN33,551 Comparação
Comparação detalhada lado a lado de LPC1316FHN33,551 por NXP Semiconductors e LPC1311FHN33,551 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | LPC1316FHN33,551 | LPC1311FHN33,551 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,82 | $1,24 |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 |
| Core Size | 32-Bit | 32-Bit |
| Max CPU Frequency | 72 MHz | 72 MHz |
| Flash Memory | 48 KB (48K x 8) | 8 KB (8K x 8) |
| SRAM Size | [DATA_NEEDED: SRAM size] | — |
| Supply Voltage Range | 2.5 V to 3.3 V | 2 V to 3.6 V |
| Encapsulamento | 32-HVQFN (7x7 mm) Exposed Pad | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Series | LPC13xx (LPC1316) | — |
| USB Controller | USB device | — |
| Serial Interfaces | USART | — |
| Pipeline | 3-stage | — |
| Architecture | Harvard, with separate instruction and data buses | — |
| EEPROM Emulation | Yes (per LPC1316 family datasheet) | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| SRAM | — | 2 KB |
| I/O Pins | — | 25 GPIO (up to 28 on family) |
| Communication Interfaces | — | I2C (Fast-mode plus), UART |
| Timers | — | 4 x General Purpose Timers |
| Package Type | — | HVQFN-33 (7 x 7 mm, 0.85 mm height) |
| Life Cycle Stage | — | ACTIVE |
| Data Converters | — | [DATA_NEEDED: ADC specification] |
| Program Memory Type | — | FLASH |
| Status RoHS | — | Compliant (per NXP standard product offering) |
| Supplier Device Package | — | 32-HVQFN (7x7) |