LPC1833JBD144E vs LPC18S30FET256 Vergleich
Detaillierter Direktvergleich von LPC1833JBD144E von NXP Semiconductors und LPC18S30FET256 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP
LPC18S30FET256 ✓ AktivSpezifikationsvergleich
| Parameter | LPC1833JBD144E | LPC18S30FET256 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,28 | $9,30 |
| Core Architecture | Arm Cortex-M3 | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | — |
| Flash Memory | 512 KB | — |
| SRAM | 136 KB | — |
| Operating Voltage Range | 2.2 V to 3.6 V | — |
| Gehäuse | LQFP-144 (20x20 mm) | 256-LBGA (17x17 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | -40C to +105C | — |
| USB Controllers | 2 x USB 2.0 High-Speed | — |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps with MII/RMII |
| ADC | 10-bit, 8 channels | 10-bit, 8 channels |
| Instruction Set | Thumb / Thumb-2 | — |
| External Memory Bus | Yes (parallel, up to 32-bit) | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | 3 |
| Lead-Free | Yes | — |
| Core Width | — | 32-bit |
| Maximale Taktfrequenz | — | 180 MHz |
| On-chip SRAM | — | 200 kB |
| On-chip EEPROM | — | 4 kB |
| On-chip Flash | — | ROMless (external memory required) |
| Operating Voltage | — | 2.4 V to 3.6 V |
| Betriebstemperatur | — | -40 C to +85 C |
| HS-USB Controllers | — | 2 (one Host/Peripheral, one Host-only) |
| External Memory Controller (EMC) | — | Yes (SRAM/SDRAM/NOR/NAND) |
| SPIFI (Quad-SPI Flash Interface) | — | Yes |
| Hardware AES Decryption | — | Yes |
| GPIO Count | — | Up to 165 |
| UART / I2C / CAN / SSP | — | 4 / 3 / 2 / 2 |