LPC18S30FET256 vs LPC1833JBD144E Vergleich
Detaillierter Direktvergleich von LPC18S30FET256 von NXP Semiconductors und LPC1833JBD144E von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP
LPC18S30FET256 ✓ Aktiv
Spezifikationsvergleich
| Parameter | LPC18S30FET256 | LPC1833JBD144E |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,30 | $9,28 |
| Core Architecture | ARM Cortex-M3 | Arm Cortex-M3 |
| Core Width | 32-bit | — |
| Maximale Taktfrequenz | 180 MHz | — |
| On-chip SRAM | 200 kB | — |
| On-chip EEPROM | 4 kB | — |
| On-chip Flash | ROMless (external memory required) | — |
| Gehäuse | 256-LBGA (17x17 mm) | LQFP-144 (20x20 mm) |
| Operating Voltage | 2.4 V to 3.6 V | — |
| Betriebstemperatur | -40 C to +85 C | — |
| HS-USB Controllers | 2 (one Host/Peripheral, one Host-only) | — |
| Ethernet MAC | 10/100 Mbps with MII/RMII | 10/100 Mbps |
| External Memory Controller (EMC) | Yes (SRAM/SDRAM/NOR/NAND) | — |
| SPIFI (Quad-SPI Flash Interface) | Yes | — |
| Hardware AES Decryption | Yes | — |
| GPIO Count | Up to 165 | — |
| UART / I2C / CAN / SSP | 4 / 3 / 2 / 2 | — |
| ADC | 10-bit, 8 channels | 10-bit, 8 channels |
| MSL-Level | 3 | 3 (168 hours) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Maximum CPU Frequency | — | 180 MHz |
| Flash Memory | — | 512 KB |
| SRAM | — | 136 KB |
| Operating Voltage Range | — | 2.2 V to 3.6 V |
| Betriebstemperaturbereich | — | -40C to +105C |
| USB Controllers | — | 2 x USB 2.0 High-Speed |
| Instruction Set | — | Thumb / Thumb-2 |
| External Memory Bus | — | Yes (parallel, up to 32-bit) |
| Lead-Free | — | Yes |