LPC55S26JBD64K vs LPC55S26JBD64Y Vergleich
Detaillierter Direktvergleich von LPC55S26JBD64K von NXP Semiconductors und LPC55S26JBD64Y von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC55S26JBD64K | LPC55S26JBD64Y |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,89 | $0,00 |
| Core Processor | ARM Cortex-M33 | ARM Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Maximale Taktfrequenz | 150 MHz | 150 MHz |
| Flash Memory Size | 256 KB (256K x 8) | — |
| RAM Size | 144 KB (144K x 8) | — |
| Security Features | ARM TrustZone (secure LPC55S2x variant) | — |
| Memory Protection Unit | Yes (MPU) | — |
| Interrupt Controller | NVIC with NMI input (selectable sources) | — |
| Gehäuse | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10 x 10 mm), exposed pad |
| Montageart | Surface Mount | Surface Mount (Gull Wing terminals) |
| Betriebstemperatur | -40C to +105C (TA) | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | 3.3 V |
| Number of I/O | [DATA_NEEDED: GPIO count] | — |
| Peripherals | [DATA_NEEDED: peripheral list] | — |
| Packaging | Tray | — |
| Series | LPC55S2x (EdgeVerse platform) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Program Flash Memory | — | 256 KB (256K x 8) |
| Temperature Grade | — | Industrial |
| Product Series | — | LPC552x / LPC55S2x |
| Process Technology | — | 40-nm NVM |
| Number of Terminals | — | 64 |
| Package Shape | — | Square |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Peripheral Compatibility | — | Pin-, software- and peripheral-compatible with LPC552x/S2x family |