LTC2287CUP vs LTC2286CUP Vergleich
Detaillierter Direktvergleich von LTC2287CUP von Analog Devices und LTC2286CUP von Analog Devices. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LTC2287CUP | LTC2286CUP |
|---|---|---|
| Marke | Analog Devices | Analog Devices |
| Kategorie | ADC/DAC | ADC/DAC |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,05 | $9,56 |
| Auflösung | 10 bit | 10 bits |
| Number of Channels | 2 (dual) | 2 (dual) |
| Sample Rate | 40 Msps | 25 Msps |
| Input Type | Differential, single-ended optional | — |
| Versorgungsspannung | 3 V (2.85 V to 3.4 V) | 3 V (single, up to 3.4 V) |
| Power Dissipation | 235 mW at 40 Msps | — |
| SNR | 61.6 dB at 70 MHz input | 61.6 dB at 70 MHz input |
| SFDR | 85 dB at 70 MHz input | 85 dB at 70 MHz input |
| Channel Isolation | 110 dB at 100 MHz | — |
| Output Interface | Parallel CMOS | — |
| Architecture | Pipelined | Pipelined |
| Input Range | 1 Vp-p differential full-scale | Up to 2 V peak-to-peak |
| Betriebstemperatur | 0 C to 70 C (commercial grade) | — |
| Gehäuse | 64-pin QFN (9x9 mm) with exposed pad | 64-pin QFN (9x9 mm, HVQCCN) with exposed pad |
| Montageart | Surface Mount | — |
| MSL-Level | 1 | — |
| RoHS-Status | Compliant | Compliant (lead-free #PBF suffix) |
| Power Consumption | — | 150 mW typical at 25 Msps |
| Channel Isolation / Crosstalk | — | 110 dB at 100 MHz |
| Data Output Interface | — | CMOS or LVDS, configurable |
| Betriebstemperaturbereich | — | 0 C to +70 C (commercial, 'C' grade) |
| Operating Mode | — | Multiplexed or simultaneous sampling |
| Reference | — | Internal, with external reference option |
| 1ku List Price (starting) | — | $9.56 (as of 2026-10-13) |