M1AFS1500-1FG256 vs A3PE600-FGG256I Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FG256 von Microchip Technology und A3PE600-FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FG256 - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
M1AFS1500-1FG256 ✓ AktivMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FG256 | A3PE600-FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $191,42 | $41,80 |
| Family | Fusion Mixed-Signal FPGA (M1 series) | ProASIC3E Flash FPGA |
| System Gates | 1500000 | 600000 gates |
| Logic Cells | 38400 | — |
| Flash Memory | 276480 bits | — |
| User I/O | 119 | 165 |
| Embedded Processor | ARM Cortex-M1 | — |
| Configuration Technology | Flash-based (non-volatile) | — |
| Speed Grade | -1 | — |
| Gehäuse | 256-LBGA (FG256) | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Montageart | Surface Mount | Surface Mount |
| Analog Blocks | Integrated configurable analog (ADC) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +85C (Industrial) |
| Versorgungsspannung | [DATA_NEEDED: core supply voltage] | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (lead free) |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Configuration Memory | — | On-chip Flash (non-volatile, single-chip) |
| Process Technology | — | CMOS flash FPGA |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |