M1AFS1500-1FG256K vs M1AFS1500-1FGG256K Vergleich

Detaillierter Direktvergleich von M1AFS1500-1FG256K von Microchip Technology und M1AFS1500-1FGG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-1FG256K M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K ✓ Aktiv
Microchip Technology
M1AFS1500-1FGG256K M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-1FG256K M1AFS1500-1FGG256K
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $627,13 $0,00
Manufacturer Microchip Technology —
Family Fusion (Mixed-Signal Flash FPGA) Fusion Mixed-Signal FPGA
System Gates 1500000 —
Logic Cells 38400 —
Number of I/O 119 119
Flash Memory 276480 bits —
Processor Core ARM Cortex-M1 (soft core) —
Speed Grade -1 —
Gehäuse 256-LBGA (FG256) —
Montageart Surface Mount Surface Mount
Configuration Technology Flash (instant-on, single-chip) —
Analog Features Configurable analog blocks (Fusion mixed-signal) —
Programmability In-System Programmable —
RoHS-Status RoHS Non-Compliant RoHS3 Compliant
Lead Free Status Contains Lead Lead Free
Betriebstemperatur [DATA_NEEDED: operating temperature range] -55C to +100C (TJ)
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
Embedded Memory Blocks [DATA_NEEDED: SRAM block size] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Number of Gates — 1,500,000 system gates
Total RAM Bits — 276480
Embedded Processor — ARM Cortex-M1
Versorgungsspannung — 1.425 V to 1.575 V (1.5 V nominal)
Max Frequency — 1282.05 MHz
Technology — 130 nm flash-based
Gehäuse / Bauform — 256-LBGA (256-FBGA, 17x17 mm)
Supplier Device Package — 256-FPBGA (17x17)
Packaging — Tray
Programmable Type — In-System Programmable (flash-based, non-volatile)
Manufacturer Lead Time — 16 weeks
Product Status — Active

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