M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
Teilenummer: M1AFS1500-1FG256K ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $771.93 | $771,93 |
| 10 | $733.33 | $7.333,30 |
| 100 | $694.74 | $69.474,00 |
| 500 | $660.14 | $330.070,00 |
| 1.000 | $627.13 | $627.130,00 |
M1AFS1500-1FG256K Übersicht
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and reconfigurable interconnects that engineers configure in the field, sitting within the broader hierarchy of programmable logic devices (PLD -> CPLD -> FPGA). The Fusion family extends a standard flash-based FPGA by integrating configurable analog blocks, large flash memory, and clock management circuitry in a monolithic die, making it a true mixed-signal programmable platform rather than a digital-only fabric.
Key differentiating features of the M1AFS1500-1FG256K include its monolithic integration of programmable analog (ADC, comparators, voltage monitors), flash-based configuration that eliminates external boot PROMs, 276480 bits of on-chip flash memory per DigiKey listing, and the ARM Cortex-M1 processor core that enables single-chip embedded control alongside custom logic. Flash-based programming also gives instant-on startup and high resistance to configuration-seizing compared with SRAM FPGAs.
Technically, the Fusion fabric is built on a CMOS flash process with VersaTile logic tiles that can be configured as combinational logic, sequential elements, or small memories. The M1 prefix denotes Fusion devices configured with the ARM Cortex-M1 soft core. The -1 speed grade and commercial operating range suit cost-sensitive industrial designs, while the 256-ball LBGA provides a compact 17x17 mm-class surface-mount footprint with high-speed signal integrity support.
Typical applications include industrial automation and motor control, smart power management and energy monitoring, handheld instrumentation, and embedded systems that combine a processor, analog supervision, and custom logic in one device.
Design consideration: this specific -K suffix part is listed as containing lead and RoHS non-compliant per available distributor data, so verify regulatory requirements for your target market before release; lead-free -FGG256 variants exist in the same family.
This page synthesizes distributor pricing, drop-in family alternatives, application guidance, and compliance data not found in any single manufacturer datasheet.
Drop-in-Alternativen für M1AFS1500-1FG256K – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-1FG256K (gleiche Bauform und Footprint) – abweichend in Family, RoHS Status, System Gates, Clock Management, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-1FG256I
✅ Drop-In✓ Auf Lager
$205 / Stück
Datenblatt ansehen →M1AFS1500-1FGG256
✅ Drop-In✓ Auf Lager
$172.23 / Stück
Datenblatt ansehen →M1AFS1500-2FGG256
✅ Drop-In✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →M1AFS1500-FG256K
✅ Drop-In✓ Auf Lager
$341.46 / Stück
Datenblatt ansehen →M1AFS1500-FG256I
✅ Drop-In✓ Auf Lager
$341.46 / Stück
Datenblatt ansehen →M1AFS1500-1FG256K Grenzwerte & elektrische Eigenschaften
| Manufacturer | Microchip Technology |
| Family | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| Number of I/O | 119 |
| Flash Memory | 276480 bits |
| Processor Core | ARM Cortex-M1 (soft core) |
| Speed Grade | -1 |
| Gehäuse | 256-LBGA (FG256) |
| Montageart | Surface Mount |
| Configuration Technology | Flash (instant-on, single-chip) |
| Analog Features | Configurable analog blocks (Fusion mixed-signal) |
| Programmability | In-System Programmable |
| RoHS-Status | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
M1AFS1500-1FG256K 256-lbga (fg256) Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-1FG256K (256-lbga (fg256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-1FG256K.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-1FG256K ist geeignet für 6 Anwendungs: Industrial Motor Control, Smart Power and Energy Management, Embedded System-on-Chip Control, Handheld and Portable Instrumentation, Test and Measurement Equipment, Industrial Networking and Communication Nodes.
Industrial Motor Control
The M1AFS1500-1FG256K fits industrial motor control because its Fusion fabric combines 1.5M system gates of flash-based logic for multi-channel PWM generation, dead-time insertion, and hardware protection interlocks with on-chip configurable analog (ADCs and comparators) for phase-current and bus-voltage sensing, while the ARM Cortex-M1 core executes the field-oriented control loop - all in one 256-ball LBGA, replacing a separate MCU plus FPGA plus ADC chain. In a typical topology, the Cortex-M1 runs current-loop software at kilohertz rates, the fabric closes faster hardware-level protection, and flash configuration gives instant-on behavior required for fail-safe equipment. Quantified benefit: single-device BOM consolidation removes at least two ICs and their associated board area. Trade-off: the -1 speed grade caps maximum PWM clocking relative to faster FPGA families, and the K lead finish limits EU RoHS-regulated deployments - specify the lead-free M1AFS1500-1FGG256I variant where compliance applies.
Empfohlen
Smart Power and Energy Management
Smart power management systems benefit directly from the M1AFS1500-1FG256K's monolithic mixed-signal architecture. The Fusion family integrates configurable analog blocks - voltage monitors, comparators, and ADC channels - that supervise multiple supply rails without external monitoring ICs, while the 1.5M-gate fabric implements power sequencing state machines and the 276480-bit flash stores configuration and logging. The ARM Cortex-M1 core handles metering algorithms and communication protocols, so a single 256-ball LBGA can replace the discrete supervisor + MCU + CPLD combination common in energy monitoring nodes. Placement is straightforward: analog inputs connect to Fusion's dedicated pins, and flash-based configuration provides instant-on supervision at power-up, which SRAM FPGAs cannot do. Performance consideration: keep analog routing away from high-drive I/O banks and use the -1 speed grade's ample timing margin for the low-speed control logic typical in power management. For RoHS-regulated consumer energy products, use the lead-free FGG variants of this same die.
Empfohlen
Embedded System-on-Chip Control
As a single-chip embedded controller, the M1AFS1500-1FG256K provides the ARM Cortex-M1 soft processor plus 38,400 logic cells of custom peripheral logic, letting designers create exactly the peripherals their application needs - custom serial engines, encoders, or bus bridges - instead of accepting a fixed MCU peripheral set. The 119 user I/Os of the FG256 package give flexible pin multiplexing, and the on-chip 276480-bit flash stores both FPGA configuration and nonvolatile application data, eliminating an external configuration device and often an external EEPROM. Firmware runs from the ARM toolchain while the fabric is developed in Microchip Libero SoC, and both are debugged through one JTAG chain, simplifying bring-up. A key quantified benefit: single-chip configuration reduces BOM count and protects the design through flash-based, single-chip programming. The trade-off is that the Cortex-M1 is a soft core, so its performance depends on fabric clocking at the -1 speed grade rather than a hard processor; verify timing closure in Libero.
Empfohlen
Handheld and Portable Instrumentation
Portable instrumentation such as handheld meters, data loggers, and field testers favors the M1AFS1500-1FG256K because Fusion's flash-based fabric starts instantly at power-on - critical for battery-powered tools that users expect to work the moment the switch is pressed - and its integrated analog inputs read sensors directly without a separate ADC. The 256-ball LBGA consolidates processor, logic, and analog in one compact package suited to small enclosures, and the 1.5M-gate capacity is ample for display interfaces, touch or button logic, measurement front-end sequencing, and the Cortex-M1 control firmware. Power consideration: fusion's static power is set by the flash fabric, so battery life in standby is predictable and no configuration boot current exists, unlike SRAM FPGA platforms that require a boot burst. Trade-off: the lead-containing K ball finish is inappropriate for consumer portable products sold in RoHS jurisdictions; choose the M1AFS1500-1FGG256 lead-free variant, which is the same silicon and footprint.
Empfohlen
Test and Measurement Equipment
Bench and modular test instruments use the M1AFS1500-1FG256K as a flexible control and glue-logic hub: the 1.5M-gate fabric implements trigger engines, counters, and protocol-aware digital channels while the ARM Cortex-M1 runs the user interface and communication stacks (USB-to-instrument bridges, SCPI parsing). The 119 I/Os of the FG256 package terminate front-panel connectors and backplane interfaces, and the flash configuration means the instrument is fully functional within microseconds of power-up with no configuration image to load - reducing apparent boot time versus SRAM FPGA designs. The 276480-bit on-chip flash can hold calibration constants and instrument identification data, removing an external serial EEPROM. Design consideration: allocate I/O banks so high-speed digital channels are separated from the analog monitoring pins, and close timing at speed grade -1 in Libero SoC before release; the -2 grade variant M1AFS1500-2FGG256 is available if timing margins are tight and lead-free finish is acceptable.
Empfohlen
Industrial Networking and Communication Nodes
Factory networking nodes - protocol converters, remote I/O couplers, and gateway modules - are a strong fit for the M1AFS1500-1FG256K. The Cortex-M1 soft processor implements protocol stacks while the 1.5M-gate fabric builds hardware line drivers and frame parsers, achieving deterministic latency that pure software solutions cannot; this partitioning is the principal advantage over MCU-only designs. The 119 I/Os support multiple fieldbus physical interfaces, and the flash-based fabric reconfigures channel personalities in the field, letting one hardware SKU serve several protocols. Flash storage (276480 bits) holds node addressing and configuration. Instant-on flash configuration also means network nodes rejoin the bus immediately after power events, improving plant recovery time. Trade-offs to engineer around: the -1 speed grade limits line rates for very high-speed protocols, and the lead-containing K finish disqualifies the part from EU RoHS-regulated products - use the pin-compatible lead-free M1AFS1500-1FGG256I instead, which is the identical die and footprint.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-1FG256K – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-1FG256I | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | M1AFS1500-FG256K | M1AFS1500-FG256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1500000 | 1500000 | 1500000 | 1500000 | 1500000 | 1500000 |
| Number of I/O | 119 | 119 | 119 | 119 | 119 | 119 |
| RoHS / Lead Finish | Non-compliant / contains lead (K) | Compliant / lead-free (G), industrial temp | Compliant / lead-free (G) | Compliant / lead-free (G) | Contains lead (K) | Lead-free, industrial temp |
| Processor Core | ARM Cortex-M1 (M1 variant) | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Configuration Technology | Flash (instant-on, single-chip) | Flash - identical | Flash - identical | Flash - identical | Flash - identical | Flash - identical |
Wichtigste Unterscheidungsmerkmale
- Lead-containing (K) finish - lowest cost within the same die family (vs. M1AFS1500-1FG256I)
- Single-chip flash configuration (vs. M1AFS1500-FG256I)
- Speed grade -1 balance of cost and timing (vs. M1AFS1500-2FGG256)
- Mixed-signal monolithic integration (vs. M1AFS1500-FG256K)
Designhinweise
The 256-ball LBGA uses a standard 1.0 mm pitch area array; design the land pattern per the FG256 drawing in the Fusion family datasheet and verify with Microchip's Libero FG256 pin file before routing. Because the balls are lead-containing on this K-suffix part, standard SnPb or mixed-finish assembly profiles must be reviewed - do not run a pure lead-free reflow profile without confirming ball metallurgy compatibility with your solder paste. Escape routing typically requires via-in-pad or 4-mil trace escapes on the outer rows.
Fusion devices require sequencing and decoupling of the core and I/O supplies; follow the power supply architecture chapter of the Fusion datasheet and Microchip's Fusion reference designs. Place bulk and 0.1 uF ceramic decoupling at each supply ball group. The analog block supply should be filtered separately from digital I/O rails to preserve ADC accuracy - route it on a quiet plane. Estimated: with typical Fusion core current in the hundreds of milliamps at full logic utilization, budget regulator headroom accordingly; exact currents depend on design utilization and should be taken from Microchip power estimation tools, not this note.
The most frequent mistake with this MPN is a compliance mix-up: the -K lead finish is RoHS non-compliant, so designs targeted at EU or consumer markets should specify the lead-free FGG variants (M1AFS1500-1FGG256/1FGG256I) instead - they are the same die and 256-ball footprint, so the swap is drop-in. Second, do not assume timing closure from a different family: regenerate and re-verify the design in Libero SoC at speed grade -1. Third, unlike SRAM FPGAs, no external configuration PROM is needed - do not add one unnecessarily.
With 119 user I/O on a 1.0 mm pitch LBGA, maintain controlled impedance on fast banks and keep series termination close to the driver balls. Assign clock inputs to the Fusion global clock-capable balls listed in the datasheet pin table to reach the low-skew clock network. Separate analog monitoring inputs from switching I/O banks to protect the integrated ADC accuracy. Simulate banks driving multiple loads with IBIS models available from Microchip.
Compliance-Informationen
Distributor datasheet data (digchip) lists Lead Free Status: Contains Lead and RoHS Status: RoHS Non-Compliant for the K-suffix part. Lead-free RoHS-compliant alternatives exist in the same family (FGG variants). REACH, halogen-free, and conflict minerals status not stated in provided data.