M1AFS1500-1FGG484I vs M1AFS1500-FGG484K Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FGG484I von Microchip Technology und M1AFS1500-FGG484K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-1FGG484I ✓ AktivMicrochip Technology
M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-FGG484K ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FGG484I | M1AFS1500-FGG484K |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $1,00 |
| Manufacturer | Microchip Technology (originally Microsemi Corporation) | — |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 1500000 gates | — |
| Logic Cells | 38400 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| User I/O | 223 | — |
| Flash Fabric Bits | 276480 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Speed Grade | -1 | — |
| Gehäuse | 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch | — |
| Package Dimensions | 23 mm x 23 mm | — |
| Temperature Grade | Industrial (-40C to +100C, I suffix) | — |
| Montageart | Surface Mount | Surface Mount |
| Analog Blocks | Configurable analog (ADC-based system monitoring) | Yes (Fusion configurable analog) |
| Clock Management | On-chip CCC clock conditioning and generation | — |
| Configuration Memory | On-chip flash (single-chip, instant-on) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | Fusion |
| Number of System Gates | — | 1500000 |
| Total RAM Bits | — | 276480 |
| Number of I/O | — | 223 |
| Versorgungsspannung | — | 1.425 V to 1.575 V |
| Core Technology | — | 130 nm flash-based |
| Gehäuse / Bauform | — | 484-BGA (FBGA, 23x23 mm) |
| Supplier Device Package | — | 484-FPBGA (23x23) |
| Programming Type | — | In-System Programmable (flash-based, non-volatile) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Product Status | — | Active |